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Thermal design supporting Gen 12 hardware: cool, efficient and reliable

In the dynamic evolution of AI and cloud computing, the deployment of efficient and reliable hardware is critical. As we roll out our Gen 12 hardware across hundreds of cities worldwide, the challenge of maintaining optimal thermal performance becomes essential. This blog post provides a deep dive into the robust thermal design that supports our newest Gen 12 server hardware, ensuring it remains reliable, efficient, and cool (pun very much intended).

Generally speaking, a server has five core resources: CPU (computing power), RAM (short term memory), SSD (long term storage), NIC (Network Interface Controller, connectivity beyond the server), and GPU (for AI/ML computations). Each of these components can withstand different temperature limits based on their design, materials, location within the server, and most importantly, the power they are designed to work at. This final criteria is known as thermal design power (TDP).

The reason why TDP is so important is closely related to the first law of thermodynamics, which states that energy cannot be created or destroyed, only transformed. In semiconductors, electrical energy is converted into heat, and TDP measures the maximum heat output that needs to be managed to ensure Continue reading