Fujitsu’s thin heat pipe could let smartphone chips run cooler
If parts of your phone are sometimes too hot to handle, Fujitsu may have the answer: a thin heat pipe that can spread heat around mobile devices, reducing extremes of temperature.Fujitsu Laboratories created a heat pipe in the form of a loop that’s less than 1mm thick. The device can transfer about 20W, about five times more heat than current thin heat pipes or thermal materials, the company said.The technology could improve smartphones’ performance by helping cool their CPUs and other heat-producing components, spreading that heat more evenly across other parts of the phone.Overheating has been an issue with some Samsung Galaxy smartphones, and the Korean manufacturer apparently dropped Qualcomm’s Snapdragon 810 processor from the Galaxy S6 due to excessive heat concerns.To read this article in full or to leave a comment, please click here